Phase Change Thermal Interface Materials

Features

  • Proprietary technology prevents excessive pump-out after initial burn-in cycle
  • Naturally tacky and heat sink preheating or additional adhesive for attachment
  • are generally not required
  • Low thermal resistance at low pressures
  • It is supplied the in rolls with a top tabbed liner for easy manual or large volume automated operations

Applications

  • High frequency microprocessors
  • Notebook and desktop PCs
  • Computer servers
  • Thermal test stands
  • DC/DC Convertors
  • Memory modules
  • Cache chips
  • IGBTs

Emei PN

Color

Thickness
(inch)

Thermal
Conductivity
(W/m-K)

Phase Change Temperature Range(℃)

"Burn-in"
Temperature (℃)

Thermal Impedance @ 10psi/50psi (℃-in2/W)

Temperature Range(℃)

Product Data Download (PDF Format)

E-Phase 800

White

0.005-0.02

2.5

50℃

75℃ for 5minutes

0.088 ~ 0.123

-40 ~ 130

PDF

E-Phase 7300

Grey

0.005-0.02

4.0

55℃

75℃ for 5minutes

0.081 ~ 0.087

-40 ~ 130

PDF

Thermal Management Materials

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