BMC 940 and BMC 945 are electrically conductive bulk molding compounds (BMC) that offer corrosion and creep resistance, high thermal and electrical performance at a significantly lower cost than metals
BMC 940 addresses the requirements of bi-polar plates for the emerging residential and automotive fuel cell market. Ideal for the molding of highly detailed bi-polar plates, this composite provides extreme flatness. BMC 945 with static dissipative and moderate level EMI/RFI characteristics, provides greater stiffness and dimensional stability than the expensive high temperature thermoplatics currently used.
Applications such as semiconductor chip processing trays and circuit board racks have benefited from BMC 945 .
942 Glue is applied for encapsulation (For more detail, please check TDS)